Dicing processing service
We offer various dicing processes, including difficult-to-dice materials, fine groove processing, and cubic capabilities.
"Dicing processing" is a method of cutting substrates into a grid pattern using a diamond blade. Our company is capable of processing substrates such as semiconductor wafers, optical glass components, and ceramics to sizes of 0.5mm and above. We will set conditions according to the specifications of the products you require. Dicing tape is advantageous in terms of cost. Cutting with wax and other materials is effective for pursuing dimensional accuracy and dicing irregularly shaped substrates. Please feel free to contact us with your requests. 【Product Lineup】 ■ Glass Dicing ■ Ceramic Dicing ■ Thick/Composite Material Laminate Wafer Dicing ■ Crystal Dicing *For more details, please download the PDF or feel free to contact us.
- Company：多摩エレクトロニクス 本社
- Price：Other
